Method for attaching semiconductor components to a substrate using local UV curing of dicing tape

ABSTRACT

A method and a system for attaching semiconductor components to a substrate are provided. In the illustrative embodiment the substrate is a leadframe, and the components are semiconductor dice or packages contained on a component substrate such as a wafer. The method includes the steps of holding and dicing the component substrate using a radiation sensitive tape. The method also includes the steps of providing a component attach system having a radiation curing system, and then performing local curing of the dicing tape during a component attach step using the component attach system. The system includes the component attach system which includes a stepper mechanism for stepping the component substrate, and a component attach mechanism having an ejector pin for pushing the components one at a time from the tape and a pick and place mechanism for placing the components on the substrate. The component attach mechanism also includes a housing having a contact surface for physically engaging the dicing tape, and an opening having an outline matching that of a singulated component.

FIELD OF THE INVENTION

This invention relates generally to semiconductor manufacture, and moreparticularly to a method and system for attaching semiconductorcomponents, such as dice and packages, to a substrate, such as aleadframe or panel, in which a dicing tape for the dice is locally curedusing radiation.

BACKGROUND OF THE INVENTION

One well known semiconductor processing step involves dicing asemiconductor wafer into singulated components. Typically the waferincludes a plurality of semiconductor dice or semiconductor packages,which are referred to herein as “semiconductor components”.

One technique for dicing a wafer is saw cutting. With saw cutting, thewafer is mounted to a support member, and a diamond tipped saw rotatingat high rpms saws the wafer along pre-formed lines known as streets.Another technique for dicing a wafer is scribing. With scribing, thewafer is again mounted to a support member, scribed along the streets,and then broken along the scribe lines by application of pressureexerted through a roller or other mechanism.

One conventional support member for dicing a wafer is known as a filmframe. The film frame includes a metal frame, and an adhesive dicingtape stretched across the metal frame. The dicing tape can comprise apolymer film having an adhesive on one or both sides or a polymer layerhaving adhesive qualities. The dicing tape is formulated to provide ahigh adhesion with the wafer in order to prevent the wafer, and thesingulated components, from moving during the dicing process. The highadhesion of the dicing tape is also advantageous for transporting thesingulated components on the film frame for further processing, such aspackaging.

However, the high adhesion of the dicing tape is a disadvantage when thesingulated components must be removed from the tape. For example,mechanisms such as pushers and vacuum picks are utilized to either pushor pull the singulated components from the dicing tape. These mechanismsare hampered by the high adhesion of the dicing tape, which must beovercome to separate the singulated components from the tape.

One prior art approach for reducing the adhesion of the dicing tape, isto construct the tape using an adhesive that is sensitive to aradiation, such as ultraviolet radiation. With a radiation sensitivedicing tape, exposure of the back side of the tape to the radiationreduces the adhesion of the tape, allowing the singulated components tobe more easily separated from the tape. Typically, the entire backsideof the dicing tape is exposed to the radiation, and adhesion of the tapecan be reduced by a factor of ten or more.

One shortcoming of this approach is that not all of the singulatedcomponents are removed from the dicing tape at the same time. Forexample, semiconductor components are often graded according to speed,and the premium components are utilized in some products, while thenon-premium components are utilized in other products. The premiumcomponents may thus be removed from the dicing tape for processing priorto the non-premium components (or vice versa). However, if all of thedicing tape has been exposed to radiation, the non-premium componentsremaining on the tape may not be secured for further transport.Accordingly, these components can move, or separate entirely from thedicing tape. This movement and separation can chip and damage the diceand cause problems in handling and in subsequent processing steps.

Another prior art approach for processing singulated components isdisclosed in U.S. Pat. No. 6,140,151 to Akram. This approach involvesexposing only selected portions of the dicing tape to radiation. Forexample, the selected portions can be adjacent to the premiumcomponents, permitting these components to be easily removed, while thenon-premium components remain attached to the tape. With this techniquea mask and a wafer stepper can be used to expose only selected portionsof the dicing tape. One shortcoming of this technique is that additionalequipment (e.g. mask, stepper), and an additional process step arerequired to expose the dicing tape.

The present invention is directed to a method and system for attachingsemiconductor components to substrates, in which radiation curing of thedicing tape is incorporated into a component attach process. Inaddition, the present invention incorporates a radiation curing systeminto the component attach system, and performs the curing stepsimultaneously with a component attach step.

SUMMARY OF THE INVENTION

In accordance with the present invention, an improved method and systemfor attaching semiconductor components to a substrate, are provided. Inthe illustrative embodiment the components comprise semiconductor diceor packages, and the substrate comprises a leadframe or a panel. Inaddition, the components are initially contained on a componentsubstrate, which in the illustrative embodiment comprises asemiconductor wafer or portion thereof.

The method includes the steps of providing a support member having aradiation sensitive dicing tape thereon, mounting a component substrateto the dicing tape, and then dicing the component substrate on thedicing tape into singulated components. The dicing step can be performedusing any suitable process, such as sawing, scribing etching or waterjetting. The method also includes the step of providing a componentattach system configured to attach adhesive members to the substrate,and then to attach the singulated components to the adhesive members.

In the illustrative embodiment, the component attach system includes acomponent attach mechanism, and a stepper mechanism configured to stepthe support member in x and y directions, such that a single componenton the dicing tape is aligned with the component attach mechanism. Thecomponent attach mechanism includes a housing having a contact surfacewith vacuum openings for holding the dicing tape, and an opening havingan outline that matches the outline of a singulated component. Thecomponent attach mechanism also includes a source of radiation (e.g., UVradiation), a fiber optic cable in communication with the source, and alens on the fiber optic cable. The lens is configured to direct theradiation through the opening in the housing, and onto the backside ofthe dicing tape.

The component attach mechanism also includes an ejector pin configuredto move through the opening, and to push the singulated component fromthe support member. In addition, the component attach mechanism includesa vacuum pick and place mechanism configured to pick up the component asit is pushed from the support member, and then to place the component onsubstrate.

During the component attach step the stepper mechanism moves the supportmember in x and y directions, to align a selected component on thedicing tape to the component attach mechanism. The component attachmechanism is then moved such that the opening in the housing aligns withthe backside of the component, with the contact surface and the vacuumopenings on the housing in contact with the backside of the dicing tapeadjacent to the component. With the component attach mechanism alignedwith the component, the radiation source is actuated to direct theradiation through the lens, through the opening in the housing, and ontothe backside of the dicing tape. This locally cures the dicing tape inthe area adjacent to the backside of the component, such that the tapeloses its adhesiveness in this area. Prior to, or simultaneously withthe component attach step, the substrate with the adhesive membersthereon, is indexed into a position proximate to the component. Theejector pin is then actuated to push the component off the dicing tape,as the pick and place mechanism simultaneously picks and places thecomponent on the substrate.

The system includes the support member and the radiation sensitivedicing tape for holding the diced components on the support member. Thesystem also includes the component attach system which is configured toattach adhesive members to the substrate, and to attach the componentsto the adhesive members. The component attach system includes thecomponent attach mechanism which comprises the housing with the openingcorresponding to the outline of the component, the flexible fiber opticcable, the lens and the ejector pin.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic cross sectional view of a component substratemounted to dicing tape on a support member;

FIG. 1A is a plan view taken along line 1A—1A of FIG. 1 illustrating thecomponent substrate and the support member;

FIG. 2 is a schematic cross sectional view illustrating dicing of thecomponent substrate using a saw;

FIG. 2A is a plan view, with parts removed, taken along line 2A—2A ofFIG. 2, illustrating the diced components;

FIG. 3 is a schematic cross sectional view illustrating a systemconstructed in accordance with the invention configured to perform localradiation curing of the dicing tape;

FIG. 3A is a reduced plan view taken along line 3A—3A of FIG. 3,illustrating a stepper mechanism of the system configured to step thecomponent substrate in x and y directions;

FIG. 3B is an enlarged plan view taken along line 3B—3B of FIG. 3illustrating a component attach mechanism of the system;

FIG. 4 is a schematic cross sectional view illustrating the componentattach mechanism engaging the dicing tape proximate to a singulatedcomponent;

FIG. 4A is an enlarged portion of FIG. 4 illustrating a lens componentof the system during local radiation curing of the dicing tape proximateto the singulated component;

FIG. 4B is a cross sectional view taken along section line 4B—4B of FIG.4A illustrating a local radiation cured portion of the dicing tape;

FIG. 5 is a schematic cross sectional view illustrating an ejector pinof the component attach mechanism pushing the singulated component as apick and place mechanism grabs the component and places the component ona substrate; and

FIG. 6 is a schematic cross sectional view illustrating anothersingulated component positioned over the component attach mechanism.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

As used herein the term “semiconductor component” refers to an elementthat includes one or more semiconductor dice. Exemplary semiconductorcomponents include bare semiconductor dice, bumped semiconductor dice,semiconductor packages, and chip scale packages.

The term “substrate” refers to an element configured to support one ormore semiconductor components. Exemplary substrates includes metalleadframes, organic leadframes, ceramic or silicon plates, glass resinpanels, and printed circuit boards.

The term “component substrate” refers to an element that includes aplurality of semiconductor components. Exemplary component substratesinclude semiconductor wafers containing dice or packages, portions ofsemiconductor wafers, and panels containing semiconductor packages.

The term “tape” refers to an element that includes a polymer substrateand at least one adhesive surface. Exemplary tapes include a polymerfilm such as polyethylene, polypropylene, polyester, or polycarbonate,having an adhesive such as an acrylic polymer on one or both sides. Thepolymer substrate rather than being a film can also comprise a depositedpolymer layer having adhesive qualities. In this case the polymer layercan comprise a material such as polyimide or epoxy in a “cured” or“uncured” condition.

The term “radiation sensitive tape” refers to a tape as defined above,in which at least one adhesive surface thereof has reduced adhesivenesswhen exposed to a radiation such as ultraviolet, infrared, thermal orradioactive.

Referring to FIGS. 1 and 1A, a step in a method for attachingsemiconductor components to a substrate in accordance with the inventionis illustrated. As an initial step, a support member 10 is provided. Thesupport member 10 is a generally circular shaped, metal frame configuredto hold a component substrate 12 for dicing and transport. In addition,the support member 10 can comprise a conventional film frame,manufactured by any one of a variety of different manufacturers.

The support member 10 includes a circular opening 16 and a radiationsensitive dicing tape 14 stretched across the opening 16. The dicingtape 14 comprises a polymer substrate having an adhesive surface 18 forholding the component substrate 12, and an opposing backside surface 20.The backside surface 20 of the dicing tape 14 can be either adhesive ornon-adhesive as required for a particular application. The adhesivesurface 18 of the dicing tape 14 includes an adhesive formulated to havereduced adhesiveness upon exposure to a radiation such as UV radiation.As the radiation is transmitted through the backside surface 20 to theadhesive surface 18, the polymer substrate of the dicing tape 14 mustalso be transparent to the radiation.

Suitable adhesive tapes for forming the radiation sensitive dicing tape14 are disclosed in U.S. Pat. No. 5,851,664 to Bennett et al; U.S. Pat.No. 5,670,260 to Zajaczkowski et al; and U.S. Pat. No. 5,304,418 toAkada et al. In addition, radiation sensitive tapes are commerciallyavailable from Minnesota Mining and Manufacturing Company, St. Paul,Minn.; and Furukawa Electric Company, Ltd. of Japan.

As shown in FIG. 1A, the component substrate 12 includes a plurality ofsemiconductor components 22. In the illustrative embodiment thecomponent substrate 12 comprises a semiconductor wafer, and thesemiconductor components 22 comprise semiconductor dice or packagescontained on the wafer. The component substrate 12 includes a circuitside 24 (face) and a backside 26 (FIG. 1). The circuit side 24 isexposed, and the backside 26 is in physical contact with the dicing tape14. Each component 22 on the component substrate 12 includes a pluralityof external contacts 28, such as planar bond pads as shown, metal bumpsor solder balls.

Referring to FIGS. 2 and 2A, a dicing step of the method is illustrated.During the dicing step the component substrate 12 is separated into aplurality of singulated components 22S. In the illustrative embodimentthe dicing step is performed using a sawing process. However, it is tobe understood that the method can be practiced using other dicingprocesses such as scribing, etching or cutting with a pressurized fluid.

As shown in FIG. 2, during the dicing step a rotating saw blade 30 cutsthrough the component substrate 12, and part way through the dicing tape14. During the dicing step the dicing tape 14 supports the componentsubstrate 12 and the singulated components 22S as well. In addition, thesaw blade 30 is configured to cut the component substrate 12 withouttouching the support member 10. The dicing step can be performed usingconventional equipment and techniques.

As shown in FIG. 2A, following the dicing step, the singulatedcomponents 22S remain on the dicing tape 14. In addition, a plurality ofspaces 32 separate the singulated components 22S. The spaces 32correspond to the saw cuts which are oriented either generally parallelor orthogonal to one another, along vertical and horizontal axes. Withthe component substrate 12 comprising a semiconductor wafer the spaces32 can correspond to the “streets” on the wafer. A width W of the spaces32 can correspond to a thickness of the saw blade 30.

Referring to FIGS. 3-3B, a system 34 for performing further steps in themethod of the invention is illustrated. The system 34 includes thesupport member 10, and the dicing tape 14 configured substantially aspreviously described. The system 34 also includes a component attachsystem 36 which is illustrated schematically as a block. In theillustrative embodiment, the component attach system 36 comprises a dieattacher modified to perform a radiation curing step during theattachment process. Die attachers are commercially available from ESCManufacturing Company, of Warrington, Pa. as well as othermanufacturers. One suitable die attacher is designated an ESC “9200” dieattach system, and is configured to attach singulated dice or packagesto leadframes.

The component attach system 36 includes a stepper mechanism 38configured to hold the support member 10 and to step the support member10 in x and y directions. The stepper mechanism 38 precisely moves thesupport member 10 so that the singulated components 22S can be alignedfor a component attach step to be hereinafter described. This type ofstepper mechanism is also known as an x-y table. The component attachsystem 36 also includes a controller 50, such as a computer, forcontrolling the operation of the stepper mechanism 38, as well as othercomponents to be hereinafter described.

The component attach system 36 also includes a component attachmechanism 40 configured to attach the singulated components 22S one at atime to a substrate 56 (FIG. 5). The component attach mechanism 40includes a generally cylindrically shaped housing 42 moveable in bothdirections along the z axis as indicated by double headed arrow 58. Adrive mechanism (not shown), such as a hydraulic or electric driveelement, drives the housing 42 along the z-axis. The drive mechanism forthe housing 42 can be in signal communication with, and controlled bythe controller 50 for the component attach system 36.

The housing 42 includes a contact surface 44 configured to physicallyengage the backside surface 20 of the dicing tape 14. The contactsurface 44 includes a plurality of vacuum openings 46 in flowcommunication with a vacuum source 48. The vacuum openings 46 direct avacuum onto the backside surface 20 of the dicing tape 14, and hold thedicing tape 14 on the contact surface 44 during a component attach stepto be hereinafter described. The contact surface 44 also includes anopening 52 having a peripheral outline that substantially matches aperipheral outline of a singulated component 22S. As shown in FIG. 3A,during a component attach step to be hereinafter described, the steppermechanism 38 steps the support member 10 such that a singulatedcomponent 22S aligns with the opening 52 in the housing 42.

The component attach mechanism 40 also includes an ejector pin 54configured to push the singulated components 22S from the dicing tape14. The ejector pin 54 is moveable by a drive mechanism 62 in bothdirections along the z axis as indicated by double headed arrow 60. Thedrive mechanism 62 can comprise a hydraulic or electric drive in signalcommunication with the controller 50. The component attach mechanism 40also include a vacuum pick and place mechanism 82 (FIG. 5) configured topick up the singulated components 22S as they are being pushed by theejector pin 54, and then to place the singulated components 22S on thesubstrate 56 (FIG. 5).

The component attach mechanism 40 also includes a radiation exposureassembly 64. The radiation exposure assembly 64 includes a radiationsource 66, a flexible fiber optic cable 68, and a lens 70. During aradiation cure step to be hereinafter described, the radiation exposureassembly 64 is configured to direct the radiation through the opening 52in the housing 42, and onto the backside surface 20 of the dicing tape14. The radiation exposure assembly 64 can be constructed fromcommercially available components and can be in signal communicationwith the controller 50. In addition, the radiation source 66 cancomprise a ultraviolet, infrared, thermal or radioactive source ofradiation having a power selected as required.

Referring to FIGS. 4-4B, a radiation exposure step performed using thesystem 34 is illustrated. Initially, as shown in FIG. 4, the housing 42of the component attach mechanism 40 is moved in the z direction asindicated by arrow 72, such that the contact surface 44 on the housing42 physically engages the backside surface 20 of the dicing tape 14. Inaddition, the opening 52 in the housing 42 aligns with the singulatedcomponent 22S. With the contact surface 44 in contact with the backsidesurface 20 of the dicing tape 14, the vacuum source 48 is actuated todirect a vacuum through the vacuum openings 46 (FIG. 3B) to hold thedicing tape 14 on the contact surface 44.

Next, as shown in FIG. 4A, the radiation source 66 is actuated to directthe radiation along the fiber optic cable 68, out of the lens 70 andthrough the opening 52 onto the backside surface 20 of the dicing tape14. A duration of the radiation exposure step can be selected asrequired.

As shown in FIG. 4B, an exposed area 74 on the adhesive surface 18 ofthe dicing tape 14 has an outline corresponding to an outline of theopening 52. In addition, the outline of the exposed area 74 correspondsto the outline of the singulated component 22S. The dicing tape 14 isthus referred to as being “locally cured”, as only the exposed area 74proximate to the singulated component 22S has been radiation cured. Theremainder of the dicing tape 14 has not been exposed to the radiation,such that is it not cured and remains adhesive or “tacky”.

Referring to FIG. 5, a component attach step performed using the system36 is illustrated. During the component attach step the substrate 56having an adhesive member 78 already attached thereto, is placedproximate to the singulated component 22S. The adhesive member 78 cancomprise cut decals of double sided tape, or can comprise a polymerdeposited in viscous form and then cured. In addition, a mechanism forattaching the adhesive member 78 to the substrate 56 can be an elementof the component attach system 36. One suitable mechanism for attachingthe adhesive member 78 is disclosed in U.S. Pat. No. 6,012,502 toVanNortwick et al., which is incorporated herein by reference.

Also during the component attach step, the ejector pin 54 is actuated tomove in the z direction as indicated by arrow 76. This pushes thesingulated component 22S from the exposed area 74 of the dicing tape 14onto the pick and place mechanism 82. The pick and place mechanism 82 isconfigured to pick (i.e., grab) the singulated component 22S usingappropriate movement and a vacuum, and then to place the singulatedcomponent 22S on the substrate 56. As shown in FIG. 5, during thecomponent attach step the dicing tape 14 “tents”, but is not penetratedby the ejector pin 54. The vacuum openings 46 holds portions of thedicing tape 14 proximate to the radiation exposed area 74 (FIG. 4B) onthe contact surface 44, and facilitate tenting of the dicing tape 14.Also, because the dicing tape 14 has reduced adhesion in the radiationexposed area 74 (FIG. 4B), the ejector pin 54 is able to more easilyseparate the singulated component 22S from the dicing tape 14. As alsoshown in FIG. 5 the pick and place mechanism 82 moves the singulatedcomponent 22S as indicated by arrow 84, and pushes the singulatedcomponent 22S against the adhesive member 78 and onto the substrate 56.

Referring to FIG. 6, following the component attach step, the housing 42is moved in the z direction as indicated by arrow 80, such that thecontact surface 44 disengages the backside surface 20 of the dicing tape14. In addition, the stepper mechanism 38 is actuated such that anothersingulated component 22S aligns with the component attach mechanism 40.

The steps in the method are then repeated substantially as previouslydescribed on all of the singulated components 22S that have beenselected for attachment to the substrate 56. However, the singulatedcomponents 22S that have not been selected for attachment to thesubstrate 56 remain attached to the dicing tape 14, as the dicing tape14 has not been cured in the areas adjacent to these singulatedcomponents 22S. This facilitates transport of these singulatedcomponents 22S on the dicing tape 14 for further processing.

Thus the invention provides an improved method and system for attachingsemiconductor components to substrates. Although the invention has beendescribed with reference to certain preferred embodiments, as will beapparent to those skilled in the art, certain changes and modificationscan be made without departing from the scope of the invention as definedby the following claims.

I claim:
 1. A method for attaching a semiconductor component to asubstrate comprising: placing the component on a radiation sensitivetape; providing a component attach mechanism comprising a surface, anopening in the surface having a substantially same outline as thecomponent, and a radiation exposure system configured to expose the tapeto a radiation directed through the opening, the system comprising afiber optic cable for transmitting the radiation; engaging the tape withthe surface with the opening aligned with the component; and exposingthe tape by directing the radiation through the opening.
 2. The methodof claim 1 further comprising placing the component on the substrateusing the mechanism.
 3. The method of claim 1 wherein the tape isattached to a support mechanism comprising a frame.
 4. The method ofclaim 1 wherein the component attach mechanism comprises a movable pinconfigured to push the component from the tape, and a pick and placemechanism configured to place the component on the substrate.
 5. Themethod of claim 1 wherein the component comprises a die or a package,and the substrate comprises a leadframe.
 6. The method of claim 1wherein the radiation comprises ultraviolet radiation, infraredradiation, thermal radiation, or radioactive radiation.
 7. A method forattaching a semiconductor component to a substrate comprising: providingthe component on a component substrate comprising a plurality ofcomponents; dicing the component substrate on a radiation sensitive tapeto separate the component from the components; providing a componentattach mechanism configured to place the component on the substrate andcomprising a fiber optic cable configured to direct radiation onto anarea of the tape proximate to the component; exposing the tape to theradiation in the area using the fiber optic cable; and attaching thecomponent to the substrate using the component attach mechanism.
 8. Themethod of claim 7 wherein the radiation comprises ultraviolet radiation,infrared radiation, thermal radiation, or radioactive radiation.
 9. Amethod for attaching a semiconductor component to a substratecomprising: providing the component on a component substrate comprisinga plurality of components; dicing the component substrate on a radiationsensitive tape to separate the component from the components; providinga component attach mechanism configured to place the component on thesubstrate, the component attach mechanism comprising a contact surfaceconfigured to physically engage the tape and an opening in the surfacehaving an outline substantially matching that of the component;providing an exposure system comprising a fiber optic cable configuredto direct radiation through the opening onto an area of the tape;physically engaging the contact surface with the tape; exposing the tapeby directing the radiation through opening; and attaching the componentto the substrate using the component attach mechanism.
 10. The method ofclaim 9 wherein the component attach mechanism comprises an element of adie attacher.
 11. A method for attaching a semiconductor component to asubstrate comprising: providing the component on a component substratecomprising a plurality of components; dicing the component substrate ona radiation sensitive tape to separate the component from thecomponents; providing a component attach mechanism configured to placethe component on the substrate and comprising a contact surfaceconfigured to physically engage the tape and an opening in the surface;providing an exposure system configured to transmit a radiation throughthe opening onto an area of the tape proximate to the component, theexposure system comprising a source of radiation, a fiber optic cablefor transmitting the radiation, and a lens for directing the radiationthrough the opening; exposing the tape to the radiation in the areausing the exposure system; and attaching the component to the substrateusing the component attach mechanism.
 12. A method for attachingsemiconductor components to a substrate comprising: providing acomponent substrate containing the components; dicing the componentsubstrate on a UV sensitive tape to separate a singulated component;providing a component attach mechanism comprising an opening, a pinconfigured to move through the opening and to push the singulatedcomponent from the tape, and a pick and place mechanism configured toplace the singulated component on the substrate; providing a source of aradiation and a fiber optic cable configured to direct the radiationthrough the opening onto only an area of the tape proximate to thesingulated component; exposing the area to the radiation using thesource and the cable; moving the pin through the opening to push thesingulated component from the area; and attaching the component to thesubstrate using the pick and place mechanism.
 13. The method of claim 12wherein further comprising following the attaching step, transportingthe components on the tape.
 14. The method of claim 12 wherein thecomponent comprises a die or a package, and the substrate comprises aleadframe.
 15. The method of claim 12 wherein the component attachmechanism comprises an element of a die attacher.
 16. The method ofclaim 12 wherein the tape is attached to a support mechanism comprisinga frame.
 17. A method for attaching semiconductor components to asubstrate comprising: providing a holder comprising a radiationsensitive tape; providing a component attach system comprising: acomponent attach mechanism having a contact surface configured tocontact the tape, an opening on the surface having a substantially sameoutline as that of the component, and a pin configured to move throughthe opening to push the components one at a time from the tape; astepper mechanism configured to align a selected area on the tape withthe opening; and a radiation exposure system comprising a fiber opticcable and a lens configured to direct a radiation through the openingonto the selected area; engaging the contact surface with the tape withthe opening aligned with the selected area; and directing the radiationthrough the opening to expose the tape in the selected area.
 18. Themethod of claim 17 wherein the component attach mechanism comprises anelement of a die attacher.
 19. The method of claim 17 wherein theradiation comprises ultraviolet radiation, infrared radiation, thermalradiation, or radioactive radiation.
 20. The method of claim 17 furthercomprising following the exposing step, placing the component on thesubstrate using, the component attach mechanism.
 21. A method forattaching semiconductor components to a substrate comprising: providinga radiation sensitive tape; providing a component attach mechanismhaving a contact surface configured to contact the tape and an openingon the surface configured for alignment with a selected component;providing a radiation exposure system configured to direct a radiationthrough the opening, the system comprising a fiber optic cable; movingthe contact surface into engagement with the tape with the openingaligned with the selected component; exposing the area by directing theradiation through the opening; and attaching an adhesive member to theselected component and to the substrate.
 22. The method of claim 21wherein the radiation comprises ultraviolet radiation, infraredradiation, thermal radiation, or radioactive radiation.
 23. The methodof claim 21 wherein the tape is attached to a holder configured to holda component substrate containing the components for dicing.
 24. Themethod of claim 21 wherein the component attach mechanism comprises ahousing with the contact surface thereon.
 25. A method for attachingsemiconductor components to a substrate comprising: providing a holdercomprising a radiation sensitive tape; transporting the components onthe holder; providing a component attach system comprising: a componentattach mechanism having a contact surface configured to contact thetape, an opening on the surface, and a pin configured to move throughthe opening and to push the components one at a time from the tape; astepper mechanism configured to align a selected component on the holderwith the component attach mechanism; and a radiation exposure systemconfigured to direct a radiation through the opening onto an area of thetape proximate to the selected component, the radiation exposure systemcomprising a source of radiation, a fiber optic cable in communicationwith the source, and a lens on the cable; exposing the area to theradiation using the exposure system; and following the exposing step,placing the component on the substrate using the component attachmechanism.
 26. The method of claim 25 wherein the tape comprises apolymer substrate and at least one surface having an adhesive thereon.27. The method of claim 25 wherein the tape comprises a polymer film andat least one surface having an adhesive surface.
 28. The method of claim25 wherein the tape comprises a polymer layer having adhesive quality.